In PCB manufacturing, managing heat dissipation is essential for maintaining the reliability and performance of modern, high-power electronic devices. Advanced techniques are employed to enhance heat transfer and prevent damage from excessive temperatures. Internal design methods such as thermal via arrays and thick copper layers allow for better heat distribution across the board, while specialized materials like Metal Core PCBs and copper coin technology ensure efficient thermal conductivity. Additionally, external solutions like heat sinks, thermal pads, and active cooling systems—ranging from heat pipes to liquid cooling—play a critical role in managing heat in demanding applications. These advanced heat dissipation techniques enable PCBs to handle the thermal challenges of today's electronics, ensuring they operate optimally even under high-power conditions.